| |
| Electronic Packaging Material |
Potting and Encapsulating Materials |
EPM-2410 |
Platinum Addition |
Trans |
Ideal for Static Mix and Dispense Applications Tack Free Within 8h at RTV |
|
| Electronic Packaging Material |
Potting and Encapsulating Materials |
EPM-2410-1 |
Platinum Addition |
White |
Ideal for Static Mix and Dispense Applications Tack Free Within 8h at RTV |
|
| Electronic Packaging Material |
Potting and Encapsulating Materials |
EPM-2410-2 |
Platinum Addition |
Black |
Ideal for Static Mix and Dispense Applications Tack Free Within 8h at RTV |
|
| Electronic Packaging Material |
Potting and Encapsulating Materials |
EPM-2420 |
Platinum Addition |
Trans |
Low Viscosity, Self-leveling Adhesive to Polyester and Polyether |
|
| Electronic Packaging Material |
Potting and Encapsulating Materials |
EPM-2421 |
Platinum Addition |
Trans |
Low Viscosity, Self-leveling General Adhesive and Encapsulate, CTE 400 ppm/ºC |
|
| Electronic Packaging Material |
Potting and Encapsulating Materials |
EPM-2422 |
Platinum Addition |
Trans |
CTE (above Tg) 490 ppm/°C 1.43 Refractive Index |
|
| Electronic Packaging Material |
Static Dissapative |
EPM-2461 |
Platinum Addition |
Black |
Static Dissapative |
|
| Electronic Packaging Material |
Potting and Encapsulating Gels |
EPM-2480 |
Platinum Addition |
Trans |
Useful for Potting Intricate Assemblies Due to Low Viscosity |
|
| Electronic Packaging Material |
Potting and Encapsulating Gels |
EPM-2481 |
Platinum Addition |
Trans |
Tough Firm Gel |
|
| Electronic Packaging Material |
Potting and Encapsulating Gels |
EPM-2482 |
Platinum Addition |
Trans |
Extreme Temperatures |
|
